Area Camera Type
R&D
We connect industrial field data with technology, and through AI machine vision and precision control research,
we create practical innovation that improves manufacturing quality and productivity.
2.5D Image Synthesis Solution
Time-Sharing Frequency Modulation (TSFM) control generates horizontal and vertical stripe patterns in various combinations simultaneously.
The projected stripes are captured on the target surface, and Phase-Shifting algorithms synthesize various 2.5D images suited for inspection—enabling three-dimensional detection of micro step differences and curvature defects.
Lighting System
Line Scan Camera Type
High-speed Align Solution Advancement
We are advancing the high-speed Align solution algorithm to develop 100 alignments per second.
Wafer Internal Crack Inspection
Using NIR (near-infrared) laser lighting with dedicated cameras, we detect internal cracks beneath the Wafer surface.
AI inspection effectively finds irregular cracks and defects with inconsistent shapes.
